NextFin News - Intel Corporation’s stock surged more than 7% on Friday, November 28, 2025, with intraday gains briefly approaching 8%, buoyed by two major industry developments reported this week.
The first catalyst came from reports that Google plans to utilize Intel’s Embedded Multi-die Interconnect Bridge (EMIB) technology for its upcoming Tensor Processing Unit (TPU) V9, with trial production slated to begin in 2027—highlighting Google’s increasing reliance on Intel’s advanced packaging capabilities for next-generation AI accelerators.
Additionally, sources suggest Intel may be in talks with Apple to supply chips for future MacBook Air models, signaling a potential comeback for Intel in the ultralight laptop segment after years of reduced presence in Apple’s product lineup.
The news originated out of Silicon Valley and was substantiated through insider channels on November 27 and 28, 2025. Intel’s EMIB technology offers superior interconnect bandwidth and power efficiency, critical for Google’s TPU designs aiming to maximize AI inference workloads performance in data center environments. Meanwhile, whispers of an Intel-Apple collaboration come amid the competitive dynamics reshaping the laptop CPU market, where Apple’s in-house silicon, previously dominant, may seek to diversify supply chains and architectures.
Google’s decision to test and gradually introduce TPU V9 with Intel’s EMIB is motivated by the need to push AI hardware acceleration capabilities while managing chip manufacturing and integration complexity. EMIB’s multi-die interconnect approach facilitates combining heterogeneous dies with optimized latency and energy use without the costly full 3D stacking processes, making it attractive for cost and performance balance in large-scale TPU deployments. Intel’s manufacturing and packaging prowess aligns with Google’s strategic roadmap targeting cloud AI inference scalability by 2027.
The potential Intel-Apple chip cooperation reportedly centers on supplying custom chips for the MacBook Air line, Apple’s flagship thin-and-light laptop segment. Apple’s prior reliance on its proprietary ARM silicon chips has dominated the market, but supply chain risks and scaling demands could have prompted Apple to explore Intel’s x86 strengths or hybrid architectures. Such a partnership could mark a paradigm shift, impacting competitive positioning between Intel, Apple, and ARM-based processor suppliers, as well as influencing software ecosystem adaptations.
The immediate market reaction reflects investor optimism about Intel’s technological relevance and business opportunities. Intel’s EMIB technology has been recognized for enabling heterogeneous integration that can extend the company’s competitive edge amid the industry’s shift towards chiplet-based designs. Alongside, re-entering Apple’s OEM supply chain could drive revenue diversification and improve Intel’s margin prospects in a consumer-driven segment historically dominated by its competitor AMD and Apple’s in-house SoCs.
From a macro perspective, this dual development signifies the broader semiconductor industry’s transformation in response to AI demand and chip supply chain realignments. Intel’s stock surge comes amid a volatile market characterized by geopolitical tensions, supply shortages, and evolving end-user requirements. The growing adoption of advanced packaging technologies like EMIB suggests a trend towards modular chip design, enabling faster innovation cycles and cost control.
Data from industry analysts show that advanced multi-die packaging adoption is expected to grow at a compound annual growth rate (CAGR) exceeding 20% through 2030, reinforcing Intel’s strategic investment in EMIB. Meanwhile, the global silicon wafer shortage easing combined with demand for specialized AI chips boosts anticipation of increased capital expenditures in production capacity expansion, benefiting integrated device manufacturers like Intel.
Looking forward, Intel’s collaborations with Google and possibly Apple position it well to capitalize on expanding AI infrastructure investment and consumer computing evolution. The Google TPU deal not only guarantees substantial volume but also long-term strategic partnership potential, as the TPU V9 deployment will likely mature into broader AI cloud service enhancements. For Apple, incorporating Intel chips could introduce product differentiation and supply chain resilience, while Intel regains foothold in premium notebook markets.
Risks remain, including execution challenges in EMIB scaling, potential integration issues on Apple platforms, and competitive pressures from other semiconductor giants pursuing AI and consumer segments aggressively. However, Intel’s ability to combine manufacturing scale, advanced packaging innovations, and strategic customer engagements may catalyze a period of renewed growth momentum amid 2025’s complex semiconductor industry landscape.
According to the most authoritative sources analyzed, these announcements reflect a significant pivot for Intel under the current U.S. administration led by President Donald Trump, who has emphasized American semiconductor competitiveness. Intel’s rising market valuation this week can be viewed as investor confidence in the company’s evolving role in next-generation technologies central to AI and personal computing domains.
