Taiwan Semiconductor Manufacturing Company (TSMC) will raise its CoWoS (Chip-on-Wafer-on-Substrate) capacity targets for the next two years, according to Taiwan Electronic Times.

Nvidia has become the company's largest customer, and other ASIC chip customers, including Google, have also been placing urgent orders to secure production capacity. Recently, TSMC made the decision to fully adjust its CoWoS capacity targets for 2026–2027 and to re-evaluate its previous advanced packaging expansion plans.

Supply chain sources have revealed that TSMC’s NanKang (Nanke) AP8 facility will add a new P2 plant, with both plants focused on CoWoS production. The original AP7 plant in Chiayi, which was primarily dedicated to WMCM, SoIC, and CoPoS packaging, will now shift its focus, converting the SoIC line to CoWoS production.