AsianFin -- Analyst Ming-Chi Kuo said in a research note that Apple's new MacBook Pro, powered by the M5 chip, may not be released until 2026.

In his report, Kuo also noted that the A20 chip for the iPhone 18 will use Wafer-level multi-chip module (WMCM) technology for packaging. This advanced technique integrates a "filling and molding process," which is expected to boost production efficiency and improve the yield rate—the percentage of functional chips produced from each silicon wafer.