AsianFin – A research team from Fudan University, led by Researcher Zhang Junwen and Professor Chi Nan from the School of Information Science and Engineering, has successfully developed a silicon photonic integrated high-order mode multiplexer chip.

By precisely designing and optimizing multi-dimensional multiplexing technology within on-chip optical interconnect architectures, the team significantly improved data transmission throughput while achieving outstanding performance in power efficiency and latency.

This newly developed chip enables ultra-high-capacity on-chip optical data transmission, supporting data transfer speeds of 38 terabits per second (Tbps). T

his breakthrough means that in just one second, 4.75 trillion parameters of a large AI model can be transmitted, significantly enhancing communication efficiency and reliability in large-scale AI model training, high-performance computing (HPC), and GPU-accelerated computing.

The chip demonstrates exceptional scalability and compatibility, making it highly suitable for various advanced computing applications.